On April 10, 2024, MediaTek announced the release of the 8-core MediaTek Dimensity 7025 chipset, which is produced with a 6-nanometer process. It features six Cortex-A55 cores at 2000 MHz and two Cortex-A78 cores at 2500 MHz.
MediaTek Dimensity 7025 Chipset Full Specifications
Launch | April 2024 |
Status | Available |
Series | Dimensity series |
Class | Mid Range |
Model Name | Will be Updated |
Chip Name | MediaTek Dimensity 7025 |
CPU
Architecture | 2x 2.5 GHz – Cortex-A78 6x 2 GHz – Cortex-A55 |
Process | 6nm |
64 Bit | 64 Bit support |
Cores | octa- core (8) |
Instruction set | ARMv8.2-A |
Max Frequency | 2500 MHz |
Transistor count | 10 billion |
Manufacturing | TSMC |
GPU
GPU | IMG BXM-8-256 |
GPU Frequency | 950 MHz |
Architecture | PowerVR IMG GPU |
Execution units | 8 |
Shading units | 18 |
Total shaders | 144 |
OpenCL version | 3.0 |
Vulkan version | 1.3 |
MEMORY(RAM)
Memory Type | LPDDR5 |
Memory Frequency | 3200 MHz |
Bus | 4x 16 Bit |
Max bandwidth | 51.2 Gbit/s |
Max Ram Size | 16 GB |
MULTIMEDIA (ISP)
Neural processor (NPU) | Yes |
Storage type | UFS 3.1, UFS 2.2 |
Max display resolution | 2520 x 1080 |
Max camera resolution | 1x200MP |
Video capture | 2K at 30FPS |
Video playback | 2K at 30FPS |
Video codecs | H.264, H.265,VP9 |
Audio codecs | AIFF, CAF, MP3, MP4, WAV |
CONNECTIVITY
Modem | LTE Cat.18 |
5G support | Yes |
Wi-Fi | 6 |
Download speed | Up to 2770 Mbps |
upload speed | Up tp 1250 Mbps |
Wi-Fi | 5 |
Bluetooth | 5.3 |
Navigation | GPS, GLONASS, Beidou,Galileo, QZSS, NAVIC |