The Dimensity 6100+, the newest addition to MediaTek’s 6000 series chipset family, has been released. It boasts cutting-edge AI capabilities for greater performance and connectivity and promises increased 5G connectivity. Look at the information below.
MediaTek Dimensity 6100+ Specification
The most recent MediaTek Dimensity 6100+ chipset is developed to provide increased network stability and higher power economy. The chipset’s primary USP revolves around its 5G capabilities. In terms of numbers, this amounts to dependable Sub-6 5G connectivity and a 20% reduction in 5G power usage compared to rival technologies.
The chipset includes an advanced 5G modem that supports the Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation. Additionally, MediaTek’s in-house UltraSave 3.0+ power consumption reduction technology further enhances its efficiency capabilities.
For improved GPU and CPU performance, the SoC has six Arm Cortex-A55 efficiency cores in addition to two Arm Cortex-A76 large cores. Moreover, a camera sensor with up to 108 Megapixels is supported. Nevertheless, the 6100+ does not provide Zero Shutter Lag (ZSL) capabilities, unlike the premium Dimensity 7050 chipset.
There’s still support for 4K videos at 30fps and camera features like AI color technology, AI-bokeh support, and much more. In addition to this smartphones utilizing the 6100+ SoC will be able to ship with 10-bit AMOLED displays with up to 120Hz refresh rate and 1.07 billion wide color reproduction ability.
Although exact information is currently unavailable, smartphones equipped with the new Dimensity 6100+ chipset will be on the market in the third quarter of 2023. Keep tuned to us for further information, and in the meantime, let us know what you think of the new MediaTek Dimensity 6100+ chipset by leaving a comment.